Ferric Process and Inductors

Ferric's magnetic core topologies provide >20A/mm2 current density and utilization factor near 100%.

Ferric’s patented thin-film magnetic core inductors are integrated on top of the chip or interposer, providing flexibility in implementation with highest integration density.

By integrating Ferric inductors with TSMC's CMOS 'back-end-of-line' (BEOL) we enable efficient, high density on-chip/on-package power conversion at any process node. 

A full library of inductor designs spanning a broad range of current, voltage and density requirements is available through Ferric's foundry partner, TSMC. Designs are optimized for high inductance, high current density, and low inductor resistance (RSL) with PDK support including broadband, nonlinear compact circuit models for inductor library components.

Ferric technology reduces: 

  • Logic board space

  • Resistive losses in power distribution networks while improving power management

  • Overall bill of materials (BOM)


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Ferric’s patented DC-DC converter designs utilize our integrated inductor technology to provide a full solution with best-in-class power density, efficiency and cost. Ferric’s power converter designs are available in single-chip, Package Integrated Voltage Regulator (PVR) format for ‘in-package’ integration and also available as licensable hard/soft circuit IP for Monolithic Integrated Voltage Regulator (MVR) implementations.

Ferric’s IVR solutions include multi-phase interleaved powertrains with >50MHz switching frequency and >10MHz regulation bandwidth. In addition to integrated inductors and capacitors, all start-up, reference, telemetry, interface, control, test and power-train circuitry is included on a single-chip or licensable circuit IP.