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current density
World's first
Integrates controller,
inductor, FETs, and
capacitors in
one component
8.9mm x 5.6mm package | 1.2mm thick
Fe 1767 Newport is a 145A, 16-phase integrated DC-DC power converter with a dual-sided architecture,enabling true vertical power delivery in a compact 49.8 mm² package.
Download Product Brief ↓
The Ferric Newport Fe1767 is a single-output integrated power converter built for high-current point-of-load applications. Its 16-phase interleaved power train integrates thin-film magnetic inductors, enabling compact and efficient power conversion close to the processor.
Newport combines high current capability, digital power management, and fast transient response in a compact device designed for advanced computing systems. The result is a power solution that supports high-performance processors while reducing board area, external component count, and layout complexity.
What makes Newport unique is its dual-sided architecture. Unlike conventional power solutions, Newport is designed to support true vertical power delivery, improving the electrical path between the power source and the processor load.
The Ferric Fe1767 Newport enables land-side integration with dual-side attach, placing the IVR directly beneath the processor package and as close as possible to the load.
In a 12-device gang-mode array, Newport devices can be positioned within the processor shadow, between the printed circuit board and package substrate. This shortens the power-delivery path and supports a more compact, efficient power architecture.
Fe1767 Newport’s dual-sided architecture separates the power input and output across opposite sides of the device.
Power enters directly from the printed circuit board through the VIN side and exits through the VOUT side toward the package substrate and processor. This enables true vertical power delivery and reduces the need for longer lateral power routing.
VIN side
VOUT side
By moving power conversion directly beneath the processor, Fe1767 Newport helps reduce interconnect distance, simplify integration, and deliver high current closer to where it is needed.
PCB → VIN → Newport → VOUT → Package Substrate → Processor
Shorter Power Delivery Network (PDN): Eliminates long, complex input routing on the processor substrate.
Resulting in 40–63% reduction in input PDN loss (simulated).
BGA Ball Savings: Frees up to 72 BGA balls per device, since it eliminates the need for VIN balls on the processor side.
The benefit is that it enables more signal routing (e.g., memory) or larger thermal pads.
Thermal Performance: No thermal penalty despite the thicker package. The freed BGA space can be used for larger thermal pads, improving heat dissipation.
The result is a marginally better thermal performance (e.g., 53°C vs. 55°C rise in one test).
High Efficiency Across the Load Range: Simulated efficiency reaches 90–94% across the load profile at VIN = 1.8 V, with a peak of approximately 94% at VOUT = 1.2 V. Early bench measurements are currently exceeding simulated performance.
Fast Transient Response: Fe1767 Newport demonstrates a 57% improvement in droop performance compared with traditional lateral power delivery. A 3–5 MHz control-loop bandwidth, enabled by high-frequency switching in the 15–60 MHz range, supports significantly faster regulation than conventional approaches.
Thermal Performance: No thermal penalty despite the thicker package. The freed BGA space can be used for larger thermal pads, improving heat dissipation.
The result is a marginally better thermal performance (e.g., 53°C vs. 55°C rise in one test).
High-frequency operation enables faster regulation and improved transient performance close to the processor load.
Initial bench results are exceeding simulated predictions.
Increasing XPU power consumption creates a space crisis for power delivery.
Traditional solutions (discrete components, large modules) are too bulky.
IVRs (Integrated Voltage Regulators) offer a slim profile but face PDN routing challenges on single-sided packages.
Contact Ferric to discuss Fe1767 Newport integration, system requirements, samples, technical specifications, and high-density power delivery applications.
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We build the world's smallest, most efficient power converters. They power the future of computing and all digital electronics.
